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Dear HIT-Kit User !
Welcome to the August 2009 edition of HIT-Kit NEWS
our e-mail newsletter issued by the austriamicrosystems Full Service Foundry Business Unit containing news, facts and information to help you to get the
best of our design kits.
In this issue you will find news about:
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Important Information: DFM Check mandatory |
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IMPORTANT
INFORMATION:
We would like to inform
you that from now on austriamicrosystems requires Design for
Manufacturability (DFM) level-1 checks as a mandatory design rule check for
every tape-out in our 0.35µm CMOS (C35), High-Voltage CMOS (H35), SiGe-BiCMOS (S35)
and Embedded EEPROM (C35EE) technologies!
Resolving DFM level 1 design rule violations may increase production
yield and is an important step in further improving the quality of your products
manufactured at austriamicrosystems, your leading analog foundry service provider
and manufacturer.
All mandatory DFM rules are described in detail in the related
DFM Design Rules
document
ENG-301, rev 3.0 available on our Download Area.
Availability status:
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HIT-Kit Updates |
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The following updates and add-ons available for the Cadence
based
HIT-Kit v3.70 have been released recently and are available on our
Download Area:
0.35µm CMOS (C35)
- New libraries IOLIBC_3B_3M and IOLIBC_3B_4M (including new pads as well as ESD improvements on existing pads)
- Fixed startup problem of the Revision Block generator
- New Analog Standard Cell ADC10A added to library A_CELLS
- Support for new devices acc. to ENG-182 Rev 6, updated SFCLIBs and new HIT-Kit Utilities menu with improved and additional features
- New circuit simulation data for Eldo, Spice, Saber, Smash, Spectre, ADSsim
- New Assura run set supporting new devices according to ENG-182 Rev 6.0
- New Calibre run set supporting new devices according to ENG-182 Rev 6.0
0.35µm SiGe-BiCMOS (S35)
- New Calibre run set: Latest run sets supporting DFM rules for S35 process
- New Assura run set: Improvements for the extraction of PLDMOS devices
- New libraries IOLIBC_3B_3M and IOLIBC_3B_4M
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Updated Design Documents |
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The following design documents have been revised
or newly released. Please download the updated documents from our
Download Area:
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HIT-Kit Documentation |
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austriamicrosystems' at the SAME 2009 |
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This year austriamicrosystems AG again will be present at the SAME 2009 (Sophia Antipolis
forum on Micro Electronics), which will take place at CICA in Sophia Antipolis, France on September 22-23, 2009.
The SAME association has the goal to valorize, promote and develop excellence in the microelectronics sector covering the design of advanced
integrated circuits in the département des Alpes-Maritimes. austriamicrosystems will present its technology
portfolio and its "Full Service" package for foundry customers. Get the most actual information on our high performance 0.18µm,
0.35µm and 0.8µm process technologies based on austriamicrosystems mixed-signal, high-voltage and RF processes.
Visit us at our booth #13 and learn more about our specialty process offerings!!
Drop an email to
foundry@austriamicrosystems.com
or call +43 3136 500 5586 to schedule an appointment with the foundry team.
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Latest Foundry News |
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July 28, 2009:
austriamicrosystems to manufacture Triad Semiconductor’s Via-Configurable SoC Solution
Triad selects austriamicrosystems advanced analog specialty 0.35µm CMOS embedded EEPROM process
for its Via-Configurable Arrays (VCA) containing an advanced 32-bit processor. austriamicrosystems business unit Full Service Foundry announced
at the DAC that Triad Semiconductor has selected austriamicrosystems for the production of its Via-Configurable Array (VCA) technology.
>> Press Release
May 27, 2009: austriamicrosystems introduces advanced Through Silicon Via technology for 3D sensor integration
austriamicrosystems business unit Full Service Foundry announced the availability of its patented Through
Silicon Via (TSV) technology for foundry customers. With the TSV technology two eight inch wafers can be electrically connected. With typical TSV depths
of 200µm to 300µm, it is especially targeting 3D integration of CMOS ICs and sensor components. Due to a flexible manufacturing concept
customer specific modifications as well as varying wafer thicknesses can be supported.
>> Press Release
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CONTACT CENTER |
austriamicrosystems AG
Tobelbaderstrasse 30
8141 Unterpremstaetten
Austria
T.: +43 (0) 3136 - 500 - 4400
F.: +43 (0) 3136 - 500 - 5696
foundry@austriamicrosystems.com
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If you do not want to receive any future HIT-Kit NEWS please send an email to
foundry@austriamicrosystems.com.
Copyright (c)
August 2009 by austriamicrosystems , 8141 Unterpremstaetten, Austria. All rights reserved.
Product and company names mentioned herein may be registered trademarks of their respective owners.
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